ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,459, issued on July 21, was assigned to NXP USA INC. (Austin, Texas). "Device packages with integrated batteries" was invented by Ankur Sha... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,460, issued on July 21, was assigned to EM Microelectronic-Marin SA (Marin, Switzerland). "Semiconductor wafer" was invented by Christophe ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,461, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Stress-reducing dielectric-to-metal adhesion architecture for e... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,462, issued on July 21, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Three-dimensional memory devices, systems, an... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,463, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Choon... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,464, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure, semiconductor device wi... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,465, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fab... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,466, issued on July 21, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.). "Solderable and wire bondable part markin... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,467, issued on July 21, was assigned to CR Runan Technologies (Chongqing) Co. Ltd. (Chongqing, China). "Semiconductor packaging method" was... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,468, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ja... Read More